Polyimide Laminates

Established in 2000, we have headquarters and manufacturing facilities in China and Taiwan, service centres across Europe and America, and quick turn panel format production facilities in America and planned for the UK and Europe. 

VENTEC designs, develops, manufactures and sells high quality copper clad laminates and pre preg bonding materials for the fabrication of  a wide variety of printed circuit board (PCB) applications. 

Established in 2000, we have headquarters and manufacturing facilities in China and Taiwan, service centres across Europe and America, and quick turn panel format production facilities in America and planned for the UK and Europe. 

We deliver consistently high quality products utilizing world class equipment from Japan and Taiwan, in coordination with specifically designed plant layouts and production flows. 

Ventec Europe's broad range of polyimide products include polyimide prepreg materials and laminates that have a low Z-axis and high Tg making them the ideal choice for high temperature service environments or anywhere were a high temperature resistance or superior thermal stability is required. 

Most traditional thermoset polyamides are renowned for their low initial bond strength and are often brittle. However, our polyimide based prepreg and copper clad laminates have a high Tg, up to 260 degrees C, making them perfect for high temperature printed board applications. Made from a tough resin system our polyamides have a greater thermal performance than epoxy-bismaleimide blends, maintaining their bond strength at extreemly high temperatures.  This means they will not weaken, melt or soften, even during long term usage.  The improved processing also makes the laminate less brittle which ultimately means there's less delamination from mechanical processing. 

Ideal for commercial, industrial, electronic and military applications, our polyamides consist of a flame resistant resin system with a flammability rating of V-0 and, of course, we guarantee that everyone of our polyimide prepreg and laminates meet all the OSHA 1910.1050 requirements.

Here at Ventec Europe, we pride ourselves on our thermosetting systems. Our polyimide resin with its very high cross linking density gives this laminate exceptionally high temperature resistance. 

Supporting all industrial and military standards the benefits of using Ventec's products can be seen at every stage of the manufacturing process. From reliable plated through hole assembly and lead free assembly compatibility, to the most technically advance polyimide resin chemistry, all our products have proven processing and performance records. 

We have a wide range of applications enabling us to supply products into many different industries.  These include surface-mount, BGA and fine-line multilayers, backplanes and MCM-L's as well as direct chip attachment, burn-in boards and high speed computing. 

Ventec Europe's extensive range of polyimide products offer PCB manufacturers consistently high quality board performance as well as genuine reliability.
 
POLYIMIDE LAMINATES, POLYIMIDE PRE PREGS, HOLE FILLING PRE PREGS, Copper Invar Copper, Infill pre pregs, UL-V0 GPY, UL-V1 GPY, UL-HB GPY